High-Density Interconnect (HDI) & Special Substrates

Designed for compact consumer electronics, automotive radar, and 5G communication systems requiring fine-pitch components and high-speed signal integrity.

HDI Build-Up Architecture

• 1+N+1 to 4+N+4 Stacking: Staggered and stacked micro-vias with copper-filled laser drilling.
• Laser Micro-via Diameter: 0.075 mm – 0.10 mm (3 – 4 mil).
• Via-In-Pad (VIPPO): Planarized resin plugging and over-plated copper surface for ultra-fine pitch BGA packages.
• Impedance Tolerance: ±5% or ±10% controlled impedance with polar test coupons.