Advanced PCB Capabilities
At first glance, printed circuit boards (PCBs) may seem similar in appearance, regardless of their inherent quality. However, the true differences lie beneath the surface, where factors critical to durability and functionality come into play.
We specialize in highly precise PCBs and offer large-scale production capabilities, ensuring that no order is too small or too large. By producing PCBs sustainably and at the lowest total cost, we prioritize competence, delivery accuracy, and product quality.
Advanced High-quality PCB Manufacturing Capabilities
| Item / Capability | Process Capability Parameter |
|---|---|
| Base Material | FR-4|High Tg|Halogen-free |
| PCB Type | Standard PCB | HDI (Any-layer support) |
| Max Layer Count | Up to 24 Layers |
| Base Copper Thickness | Min 1/3 OZ (12μm) |
| Max Finished Copper Thickness | Up to 8 OZ |
| Min Trace Width / Spacing | Inner/Outer Layers 2/2 mil |
| Hole to Conductor Spacing | Min 6 mil (Inner & Outer) |
| Annular Ring | Via: 3 mil Component Hole: 5 mil |
| BGA Specification | Diameter: 8 mil Min Pitch: 0.4 mm |
| Min Hole Size | CNC: 0.15 mm Laser (Blind/Buried): 0.1 mm |
| Max Aspect Ratio | 20:1 |
| Soldermask Bridge Width | Min 3 mil |
| Circuit Processing Method | Film | LDI (Laser Direct Imaging) |
| Surface Finish Type | HASL Lead-Free | ENIG | OSP | ENEPIG | Hard Gold | Immersion Silver(Ag) | Immersion Tin |
| Max PCB Size | 609 * 889 mm |
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