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Flex PCB

FLEX
1–8L Flex & Rigid-Flex Polyimide (PI) · PI/FR-4/Steel Stiffeners Dynamic Bending · EMI Shield · IPC-6013 ZIF Gold Fingers · 24–48h Turn

Skip manual entry — auto-fill your entire quote in seconds. No measuring, zero spec mistakes.

2D CAM GeometrySize · Panel Grid · Layers · Trace/Drill
Spec Doc & StackupReads PDF/Doc for Thickness, Oz & Finish
SMT & Stencil SyncPad/Pin counts · Auto-matched stencil
2D Preview & Zero Re-UploadTop/Bot render · Carries straight to cart
ZIP, RAR, 7Z, TAR.GZ (RS-274X / X2 / ODB++ / IPC-2581, up to 100 MB)· Encrypted · Unordered files auto-deleted in 24h

Basic Information

Material:
FR-4 / Halogen-free Universal
General-purpose industry epoxy laminate for consumer electronics and standard multilayer designs.
High-Tg FR-4 (HDI Grade) Tg ≥ 170°C
Enhanced thermal reliability and low Z-axis CTE, engineered for laser microvias, fine-pitch BGA, and HDI buildups.
Aluminum Base 1~3 W/m·K
Superior heat dissipation over FR-4. Recommended for high-power LED & power boards.
Copper Core ~400 W/m·K
Highest thermal conductivity with thermoelectric separation for extreme heat flux.
Rogers (High-Frequency) Low Df
Ultra-low dielectric loss & stable Dk for RF, radar, and 5G microwave applications.
Flexible PCB
Layers:
Copper Foil Layers Definition
Total number of conductive copper routing/plane layers in the PCB stackup.
Even Layer Recommendation Design Tip
Even-layer stackups (2, 4, 6...) ensure physical symmetry and minimize board warpage.
1 2 4 6 8
Different Design:
A A A A
1 Design (A+A)
VS
A B B
2 Designs (A+B)
Definition Number of Designs
The number of unique Gerber layouts/sub-boards combined into a single panel file.
Identical Boards Default = 1
If your panel repeats the same board (e.g. 2x2 of Board A), keep it as 1.
* Multiple different designs combined into one panel will incur additional engineering/cutting fees.
-+
*Size (single):
Circle: L = W = D
&
Irregular: Max X × Y
Rectangles & Squares Regular
Enter the exact outer finished dimensions (Length × Width) of the board outline.
Circular Boards Diameter
Set both Length and Width equal to the circle's outer diameter (e.g. 50mm × 50mm for a ⌀50mm board).
Irregular Outlines Bounding Box
Input the maximum dimensions (maximum X and maximum Y) of the minimum bounding box that fully encloses the board.
* If ordering as "Panel", please enter the overall outer panel dimensions including tooling rails.
(mm)
x
(mm)
*Quantity (single):
Quantity (Single) Default
Total number of individual, routed circuit boards to be delivered.
Quantity (Panel) Array Mode
Total number of panelized arrays/pallets ordered (each panel contains multiple sub-boards/units).
* Important: If "Panel" delivery is selected, enter the total number of Panels required, not the individual board count.
pcs
Delivery Format:
Single PCB
VS
Panelized Array
Single PCB Prototyping
Produced and delivered as individual routed boards without breakaway rails. Best for prototyping and manual assembly.
Panel by Customer Supplied Array
Manufactured strictly according to the pre-panelized Gerber file you supply (including custom rails, fiducials, and mouse-bites).
Panel by PCBPath Free Service
Provide a single Gerber; we generate the panel array with tooling rails, fiducials, and V-Cut according to your specifications.
* Note: "Panel by PCBPath" only supports regular shapes (rectangles/circles). For irregular or complex outlines, please select "Panel by Customer".
Single Piece Panel by Customer Panel by PCBPath
Quality Standard:
1. Physical Fabrication (IPC 6012) Class 2 (Commercial) vs. Class 3 (High-Reliability) Class 3: Cu ≥ 25 µm Class 2: Cu ≥ 20 µm Class 3: Zero Breakout (Ring ≥ 50µm) IPC Class 3 Is Mandatory for Automotive & Medical 2. Industry Assurance Overlay Built on IPC Class 3 + Certified Quality Management Systems Automotive (IATF 16949 + Class 3) PPAP Level 3 documentation, CPK ≥ 1.67, AEC-Q substrate reliability Powertrain · ADAS Radar · EV Inverters & Battery Management Medical (ISO 13485 + Class 3) ISO 14971 Risk management, bio-compatibility, 10-year traceability Surgical Robots · Implantable Monitors · Life-Critical Diagnostics Full Lot Traceability & Regulatory Audit Compliance
Standard (IPC Class 2) Commercial & Industrial
The default manufacturing baseline for computing, telecom infrastructure, and general industrial equipment. Allows up to 90° breakout on internal annular rings; average hole-wall copper plating is ≥ 20 µm (min. individual point 18 µm). Delivers the best balance between high production yield and cost efficiency.
High-Reliability (IPC Class 3) Aerospace & Zero-Fail
• Tightened Tolerances: Mandates zero breakout on annular rings (minimum internal ring width ≥ 50 µm / 2 mil) and heavier hole-wall copper plating ≥ 25 µm (min. 20 µm).
• Microsection Verification: Includes destructive microsectioning per production panel, metallurgical microscope cross-section reports, and thermal stress solder-float testing for mission-critical electronics.
Automotive (IATF 16949 + IPC Class 3) Automotive Supply Chain
Built strictly to IPC Class 3 physical standards under certified IATF 16949 automotive quality systems. Mandates statistical process control (Cpk ≥ 1.67), defect prevention (FMEA), automotive-grade high-Tg laminates, and complete PPAP Level 3 documentation (PSW, control plans, material lab certifications). Engineered to withstand extreme thermal shock (-40°C to +150°C) and heavy vehicle vibration.
Medical (ISO 13485 + IPC Class 3) Healthcare & Life Support
Built strictly to IPC Class 3 physical standards within an ISO 13485 certified medical environment. Features cleanroom manufacturing controls (Class 10,000 / 100,000), ionic contamination testing, biocompatibility verification, and 10–15 year lot-level raw material traceability to guarantee compliance with ISO 14971 risk management, FDA, and EU MDR regulations.
* Certification Deliverables: Selecting High-Reliability, Automotive, or Medical automatically activates designated test coupons, certificate of conformance (CoC), microsection inspection reports, and full-process traceability archiving.
Standard (IPC Class 2) High-Reliability (IPC Class 3)

PCB Specifications

Flex Thickness:
0.1mm 0.13mm 0.15mm 0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm
Outer Copper Weight:
3D Layer Structure Top / Bottom Copper Foil + Barrel Plating Outer Trace (Top) PTH Plating Finished Thickness = Base Foil + Plated Copper Outer Copper Weight Options Thickness vs. Typical Application 1 oz ~35 µm Standard Dense Traces 2 oz ~70 µm Power & LED Motor Drivers 3 oz ~105 µm Heavy Current Power Busbars
What is Outer Copper Weight? Thickness & Plating
The total finished copper thickness on the exterior layers (Top and Bottom) of the board, measured in oz/ft². Because outer layers undergo through-hole electroplating, the final finished thickness equals the base copper foil plus the plated copper layer.
Selection Guide Current & Thermal
• 1.0 oz (~35 µm): Standard default for general consumer electronics, microcontrollers, and high-density fine-pitch traces.
• 2.0 oz (~70 µm): Recommended for power supplies, battery management systems (BMS), and motor drivers requiring higher current and heat dissipation.
• 3.0 oz+ (≥105 µm): Heavy copper for high-power distribution; requires enlarged trace width and spacing to prevent etching undercut.
* Manufacturing Rule: Selecting heavier outer copper (2 oz or 3 oz) requires larger minimum trace width and clearance in your design.
1/3oz 0.5oz 1oz 2oz
Min Trace / Spacing:
Top View (Clearance Types) T-to-T T-to-P P-to-P Edge-to-Edge Copper Clearance Trace & Space (W / S) Measured across all conductive elements (Traces, Pads, Polygons) Cross-Section (Trace Profile & Gap) Dielectric Substrate (FR-4 / Core) Copper 1 Copper 2 Trace Width (W) Min Spacing (S) Fabrication Capability & Limits: • Standard: ≥ 5/5 mil (0.127 mm) • Advanced (Thin Cu): ≥ 3.5/3.5 mil • Heavy Copper (> 1 oz): Larger spacing required
What is Minimum Spacing (Clearance)? Design Rules (DRC)
Minimum spacing is the smallest allowable edge-to-edge distance between any two adjacent copper elements (Trace-to-Trace, Trace-to-Pad, or Pad-to-Pad). Adequate spacing prevents electrical shorting, eliminates copper bridging during chemical etching, and ensures sufficient dielectric isolation.
Copper Thickness vs. Minimum Spacing Manufacturing Constraints
Chemical etching produces an isotropic undercut effect (etch factor). As copper thickness increases, lateral etching widens the spacing requirement:
• 1/3 oz – 1/2 oz Cu: Capable of ultra-fine lines and spacing down to 3/3 mil.
• 1 oz Cu (Standard): Reliable industry standard spacing is 4/4 mil to 5/5 mil.
• 2 oz Cu & above: Requires spacing ≥ 6–8 mil to avoid incomplete etching and residual copper micro-bridges.
* Engineering Verification: Our CAM engineers verify all layer clearances against netlists and selected base copper weight. Spacings below manufacturer threshold will be flagged for DRC revision or require an advanced process upgrade.
2/2mil 4/4mil 5/5mil 6/6mil↑
Min Hole Size:
Top View (Hole & Annular Ring) Hole Dia. (d) Ring (t) Finished Hole Size = Drill Bit - Plating Pad vs. Drill Geometry Outer Pad Dia. = Hole Dia. (d) + 2 × Annular Ring (t) Cross-Section (Plated Through Hole) FR-4 Core Finished Hole (d) Annular Ring PTH Barrel Fabrication Capability & Limits: • Standard Mechanical Drill: ≥ 0.20 mm (8 mil) • Advanced / Micro-via: 0.15 mm (Mechanical) / 0.10 mm (Laser) • Min Annular Ring: ≥ 0.10 mm (4 mil) to prevent breakout
What is Minimum Hole Size? Drill & Tooling
Minimum Hole Size designates the smallest finished diameter for Plated Through-Holes (PTH) or Non-Plated Through-Holes (NPTH). During fabrication, mechanical drill bits must be sized slightly larger than finished hole specifications to accommodate copper barrel electroplating (typically 20–25 μm wall thickness).
Annular Ring Requirements Interconnect Reliability
The annular ring is the copper rim remaining around the drilled hole edge. Sufficient width prevents drill breakout caused by mechanical tolerances during lamination and drilling:
• Standard Annular Ring: ≥ 0.125 mm (5 mil) for outer layers; ≥ 0.10 mm (4 mil) for inner layers.
• Aspect Ratio Constraint: Board thickness to hole diameter ratio typically should not exceed 8:1 – 10:1 for standard plating penetration.
* Engineering Verification: Our CAM engineers review hole dimensions, hole-to-trace spacing, and pad rings. Holes smaller than manufacturing thresholds or with insufficient annular ring margins will be flagged for design review or process upgrading.
0.1mm 0.15mm 0.2mm 0.25mm 0.3mm↑
Coverlay Color:

Polyimide (PI) coverlay film laminated over the flexible circuit to insulate and protect copper traces while maintaining high dynamic bending durability.

Yellow (Default)Standard
Natural amber Polyimide (PI) coverlay with the best flexibility, heat resistance (260°C reflow), and shortest lead time.
Black / White
Matte black coverlay for light-blocking/aesthetics, or white coverlay for high light reflectivity in LED flex strips.
* Silkscreen legend color automatically pairs for maximum contrast (White text on Yellow/Black; Black text on White).
Yellow Black White
Silkscreen:
Recommended Contrast Pairings U1 White on Green / Red Standard Default (Highest Clarity) U2 Black on White Mask Auto-Matched for White Mask Q1 White on Black / Blue High Contrast Modern Finish DFM: Minimum Text & Stroke Limits 1. Min Character Height (H) A H ≥ 0.80 mm (~32 mil) 2. Min Stroke Width (W) W ≥ 0.15 mm (~6 mil)
Automatic Color Pairing Default Logic
• White Silkscreen: Automatically paired with Green, Black, Blue, and Red solder masks to ensure maximum readability and sharp contrast.
• Black Silkscreen: Automatically selected when a White or Yellow solder mask is chosen to prevent text wash-out.
DFM Legibility & Clearance Rules Manufacturing Limit
• Min Character Height (H): ≥ 0.80 mm (32 mil). Text below this height may become blurred or illegible during screen printing or inkjet curing.
• Min Stroke Width (W): ≥ 0.15 mm (6 mil). Thinner strokes can break or disappear during UV curing.
• Pad Clearance: Silkscreen must remain ≥ 0.15 mm (6 mil) away from solder mask openings. Our automated CAM process will clip overlapping text to prevent ink from contaminating solder joints.
* CAM Auto-Clipping: Silkscreen placed directly over exposed pads or test points will be trimmed automatically according to IPC standards to prevent soldering defects.
White Black
Copper Type:

Specifies the manufacturing process and grain structure of the copper foil used in the flexible laminate (FCCL).

Electro-deposited (ED - Default)Standard
Vertical columnar grain structure ideal for static flex-to-install applications and fine-pitch trace etching.
Rolled Annealed (RA)Dynamic Flex
Horizontal lamellar grain structure with superior metal fatigue resistance for high-cycle dynamic bending (hinges, gimbals, sliding mechanisms). Available for 1–2 layer boards with ≤1oz copper.
Electro-deposited Rolled Annealed
Surface Finish:
ENIG Electroless Nickel Immersion Gold · Ultra-Flat Surface HASL(with lead) / LeadFree HASL Hot Air Solder Leveling · Budget Friendly & Reliable
ENIG (Electroless Nickel Immersion Gold) Flat & Long Shelf-Life
Chemically deposited thin gold over an electroless nickel barrier layer. Provides an exceptionally flat, non-oxidizing, gold-plated surface essential for tight-pitch BGAs, QFNs, fine-pitch SMDs, and high-reliability products.
HASL (with lead) / LeadFree HASL Economical
Coated with molten solder alloy and leveled by hot air knives. Highly cost-effective with excellent through-hole solderability and robust joints. Choose LeadFree HASL for RoHS/environmental compliance.
Specialty Finishes (OSP, ENEPIG, Immersion Ag/Sn) Special Applications
• OSP (Organic Solderability Preservatives): Ultra-flat organic anti-oxidation coating directly on copper; economical but sensitive to multiple thermal reflows.
• ENEPIG (Universal Finish): Adds a palladium barrier between nickel and gold; completely eliminates black pad risks and is certified for gold wire bonding.
• Immersion Silver / Tin: Ultra-flat planar finishes optimal for high-speed differential signal integrity and tight press-fit connector applications.
* Selection Rule: Always specify ENIG if your design features QFNs, BGAs, or component packages ≤ 0402/0603. Choose HASL / LeadFree HASL for general through-hole boards or cost-sensitive prototypes.
ENIG(Immersion Gold) ?
What is ENIG Surface Finish? Electroless Nickel Immersion Gold
ENIG is a premium two-layer metallic finish featuring a 3–6 µm (120–240 µin) electroless nickel barrier topped with a thin 1–2 µin immersion gold layer. Gold prevents nickel oxidation during storage, while the nickel layer serves as the true solderable base and copper diffusion barrier.
Key Advantages Planarity & Reliability
• Superior Coplanarity: Delivers an ultra-flat, planar surface critical for fine-pitch BGA, CSP, QFN, and 0201/01005 SMD components.
• Long Shelf Life: Outstanding oxidation and corrosion resistance ensures a guaranteed storage life exceeding 12 months in vacuum packaging.
• Multi-Functional: Excellent for multi-cycle thermal reflows, contact pads, edge test points, and dome-switch buttons.
Quality Standard IPC-4552 Compliant
Manufactured strictly to IPC-4552 specifications with tightly controlled chemical displacement rates to eliminate any risk of black pad defects.
OSP ?
What is OSP Surface Finish? Organic Solderability Preservatives
OSP applies an ultra-thin (0.2–0.5 µm), transparent organic protective layer directly onto bare copper pads. It shields the copper from oxidation during storage and dissolves cleanly during reflow soldering under flux.
Key Advantages Flatness & Cost
• Superior Coplanarity: As flat as the bare copper itself, making it ideal for fine-pitch BGA, QFN, and tight SMD footprints where HASL creates uneven pads.
• Cost-Effective & RoHS: Simpler chemical process with substantially lower manufacturing cost compared to ENIG and Immersion Silver.
Storage & Assembly Precautions Handling Rules
• Shelf Life: Highly sensitive to humidity and air exposure; SMT assembly is recommended within 6 months (and within 24 hours once unsealed).
• Thermal Limit: Best suited for single-sided SMT or limited thermal cycles; repeated reflow passes degrade the protective film.
Hard Gold ?
What is Hard Gold Surface Finish? Electrolytic Hard Gold
Hard Gold is an electroplated gold layer alloyed with a small amount of cobalt or nickel (typically 99.7% pure gold) over an electroplated nickel base. This alloy significantly increases surface hardness (130–200 Knoop) compared to soft immersion gold.
Key Advantages & Durability Friction & Wear Resistance
• High Insertion Cycles: Engineered specifically to withstand repeated mechanical friction, rated for hundreds to thousands of insertion/mating cycles without flaking or wear.
• Heavy Plating Thickness: Available in heavier thicknesses (typically 5–50 µin or higher, compared to 1–2 µin for ENIG) depending on wear demands.
• Ideal Contact Surfaces: The industry benchmark for edge connectors (PCIe/PCI gold fingers), keypad contact matrices, card readers, and test probe pads.
Soldering Limitation Design Note
Due to its thickness and alloy content, Hard Gold has poor solderability and can cause brittle solder joints (gold embrittlement). It is strictly intended for mechanical contact points rather than standard SMT component solder pads. Selective plating (ENIG on SMT pads + Hard Gold on edge fingers) is commonly applied.
ENEPIG ?
What is ENEPIG Surface Finish? The Universal Finish
ENEPIG is an advanced three-layer metallic finish composed of Electroless Nickel (3–6 µm), Electroless Palladium (0.05–0.15 µm), and Immersion Gold (0.025–0.05 µm). The added palladium layer acts as a barrier that prevents gold from corroding the nickel, completely eliminating the "black pad" risk.
Key Advantages Wire Bonding & Reliability
• Wire Bonding Capable: Fully compatible with both gold (Au) and aluminum (Al) wire bonding, making it ideal for chip-on-board (COB) and sensor packaging.
• Multi-Cycle Reflow: Resists degradation across multiple lead-free reflow passes, ideal for complex double-sided mixed-assembly boards.
• Zero Black Pad Defect: The palladium barrier preserves nickel integrity during gold deposition, ensuring top-tier solder joint fracture resistance.
Standard & Applications IPC-4556 Compliant
Manufactured in compliance with IPC-4556. Commonly specified for aerospace, military, medical implants, automotive ADAS, and high-frequency wireless modules requiring maximum reliability.
Thickness Of Immersion Gold:
1. Standard ENIG: 1U" (0.025 µm) Default SMT & BGA Assembly · Optimal Solderability Au: 1U" (0.025 µm) Ni Barrier: 3–6 µm (120–240 U") Base Copper Pad (Cu) 1U" = 1 Microinch (µin) ≈ 0.025 µm · Standard Choice 2. Heavy ENIG: 2U" – 3U" (0.05 – 0.075 µm) Thick Gold Deposit · Wire Bonding & Contact Durability Wire Bonding Loop Heavy Au: 2U"–3U" (2–3x Thicker) Pogo-Pin & Contact Pad Protection IPC-4552 Compliant · Extended Oxidation Barrier
What is Immersion Gold Thickness (U")? ENIG Dual-Layer Finish
In Electroless Nickel Immersion Gold (ENIG), a barrier layer of 3–6 µm (120–240 U") electroless nickel is plated over the copper pads, capped by an atomically thin layer of pure gold. The gold thickness is measured in microinches (U" or µin), where 1U" ≈ 0.0254 µm. The gold layer protects the underlying nickel from oxidation prior to soldering.
Selection Guide: 1U" vs. 2U" / 3U" IPC-4552 Standards
• 1U" (≈ 0.025 µm) — Default Standard: Ideal for 95%+ of SMT, fine-pitch QFP, and BGA assemblies. During reflow, the thin gold layer dissolves rapidly into the solder paste, allowing a strong Sn-Ni intermetallic joint without risking gold embrittlement.
• 2U" (≈ 0.050 µm) — High Reliability & Contacts: Recommended for boards requiring Aluminum (Al) wedge wire bonding, spring-loaded pogo-pin test pads, dome keypad contacts, or multiple reflow cycles under harsh storage environments.
• 3U" (≈ 0.075 µm) — Aerospace & Special Bonding: Selected for specialized semiconductor packaging, long-term archival storage (> 12–24 months), and mission-critical industrial sensors exposed to corrosive atmospheres.
Engineering Note: ENIG vs. Electrolytic Hard Gold Important Distinction
Immersion Gold (ENIG) is chemically deposited pure (soft) gold limited to 1U"–3U". If your board features high-wear edge connectors (such as PCIe cards) requiring 15U"–50U" of cobalt-hardened gold for hundreds of mating cycles, please select Hard Gold (Gold Fingers) instead.
* Solder Joint Caution: Gold thickness exceeding 3U" in standard tin-silver-copper (SAC305) solder joints may cause AuSn4 brittle fracture (Gold Embrittlement). Stick to 1U"–2U" for standard SMT soldering.
1U" 2U" 3U"

*1U"=0.0254um, U" means µin.

Gold Fingers:
Gold Finger Contacts (Top View) PCIe / RAM / High-Wear Edge Interface SOLDER MASK OPENING Bevel Line Width (W) Gap (S) Board Edge (Beveled 20°~30°) 3D Beveled Edge Chamfer (20° ~ 30°) Milled Slope Protects Socket Gold Springs 20° ~ 30° Bevel Angle Card Insertion Direction
What are Gold Fingers? Edge Contacts
Gold Fingers are the hard gold-plated contact pads along the mating edge of a PCB (e.g., PCIe cards, RAM modules, expansion cards). They offer low contact resistance and high friction wear resistance for repeated insertions.
Surface Finish Matching Rule Plating Process
• With ENIG: Gold fingers are plated with gold (Electroless Nickel Immersion Gold / Hard Gold).
• With HASL: If HASL surface finish is selected, the edge contacts will be finished in HASL (tin-lead) rather than gold plating.
Edge Chamfering (Beveling) Mechanical Processing
To allow smooth insertion without scraping or damaging socket contact pins, the connector edge is mechanically beveled at 20° or 30° (or 45° upon request). Keep internal copper planes and vias at least 1.0 mm away from the beveled edge.
* Layout Note: Keep copper planes, traces, and vias at least 1.0 mm away from the chamfered board edge to prevent copper exposure during edge machining.
No Yes
Stiffener:

Rigid reinforcing material laminated to specific areas of a flexible PCB (such as ZIF connector fingers or heavy component mounting zones). Multiple stiffener types can be selected simultaneously.

Polyimide (PI)ZIF Gold Fingers
Used on the back of ZIF connector fingers to build up the standard 0.30mm±0.03mm insertion thickness.
FR4 / Stainless SteelMechanical Support
FR4 (cost-effective) or SUS304 Stainless Steel (ultra-thin, high rigidity & heat dissipation) used behind connectors, ICs, or BGA areas to prevent solder joint stress.
* Please clearly mark the stiffener outline, side (Top/Bottom), and material in your Gerber mechanical layer.
Without Polyimide (PI) FR4 Stainless Steel 3M Tape
EMI Shielding Film:

Ultra-thin (18μm) black electromagnetic interference (EMI) shielding film laminated over the coverlay to prevent signal crosstalk and external EMI noise in high-speed flex cables (MIPI, LVDS, USB) while maintaining high flexibility.

Single side / Both sides (Black, 18μm)
Connected to the PCB ground (GND) via laser/coverlay grounding openings using isotropic conductive adhesive.
* Please indicate the coverlay GND opening areas for EMI shielding grounding in your Gerber files.
Without Single side (Black, 18μm) Both sides (Black, 18μm)
Cutting Method:

Specifies the outline profiling method for the flexible PCB.

Laser Cutting (Default)Prototypes & Batches
High-precision UV laser cutting (±0.05mm accuracy) with zero tooling cost. Ideal for prototypes and small-to-medium volume production.
PunchingMass Production Panel
Mechanical die stamping for high-volume panelized orders. Requires a custom stamping die (tooling fee applies) but significantly reduces unit processing time.
Laser Cutting Punching ?

Why is Punching disabled for online instant quotes?
Mechanical die punching requires fabricating a custom precision steel die ($500–$1,200 tooling fee, 5–7 days tooling lead time). It is only cost-effective for recurring mass production orders ≥ 5,000 pcs (or ≥ 5 m²). For prototypes and small-to-medium batches, UV Laser Cutting offers higher precision (±0.05mm) with zero tooling cost. For mass-production punching quotes, please contact our engineering team.

Advanced Options

Board Outline Tolerance:
Regular Routing (±0.2mm) Single-Pass CNC Routing · Default Standard 100 × 80 mm (Design) 79.8 - 80.2 mm 99.8 - 100.2 mm Tolerance: ±0.2mm (Standard) Precision Routing (±0.1mm) Rough + Fine Two-Pass CNC Routing 100 × 80 mm (Design) 79.9 - 80.1 mm 99.9 - 100.1 mm Tolerance: ±0.1mm (Precision)
CNC Routing Methods Manufacturing Differences
• Regular Routing (±0.2mm): PCB panels are clamped externally and cut in a single-pass routine. The default, cost-effective choice for general enclosures and standard electronic assemblies.
• Precision Routing (±0.1mm): Utilizes high-precision internal tooling pin holes within board borders and executes a rough pass followed by a second fine finishing pass. Guarantees tight dimensional accuracy and ultra-smooth edge boundaries.
Selection Recommendation Application Guidelines
Select Precision Routing (±0.1mm) if your PCB fits tightly into custom CNC-milled aluminum enclosures, molded plastic housings, slide-in card guide rails, or dense modular edge-mating assemblies where mechanical clearance tolerance is critical.
±0.1mm (Regular) ±0.05mm (Precision)
Electrical Test:
1. AOI (Automated Optical Inspection) Optical trace scan · Catches breaks, shorts & etching defects PASS Baseline Yield: ≥ 99% Clean Traces 2. Flying Probe Electrical Test (FPT) High-precision probes · Verifies 100% netlist circuit continuity CLOSED LOOP (0.0Ω) Full Test: 100% Net Continuity
Baseline Quality: Automated Optical Inspection (AOI) Standard for All Boards
Every PCB produced undergoes comprehensive AOI scanning to examine trace widths, copper spacing, and surface geometries against original CAD files. AOI effectively flags etched micro-fractures, mousebites, and bridging, ensuring a baseline product yield of 99% or higher before electrical verification.
Flying Probe Testing (FPT) Prototype & Small Batches
• Full Test (100% Coverage): Every single board on the panel is probed for 100% continuity assurance. Recommended for high-density, mission-critical, or complex multi-layer designs.
• Random Test (Sampling): Representative boards from each production batch are sampled and tested at no additional cost, ensuring an overall batch pass rate of ≥ 99%.
E-Test Fixture (Bed-of-Nails) Mass Production
A custom physical test fixture built with high-density pogo pins that contacts all test points simultaneously in a single press. While it involves a one-time tooling and material setup cost, it provides near-instantaneous test speeds, making it the most cost-effective choice for volume manufacturing.
* Electrical Verification Note: Flying probe testing directly validates IPC-D-356 netlists generated from your Gerber files to prevent open/short defects before shipment.
100% Flying Probe Test E-Test Fixture

Note: 100% AOI optical inspection is included by default for all boards.

Remove Product No.:
Specify Location (Free of Charge) P261001_8892_A01 Order No. Specify via "PCBPATH" (or "PP") (Free) Remove Product No. (~$1.5 Extra) Zero Factory Markings 100% Clean Surface (~$1.5 Extra)
Why Add a Product Number? Traceability
By default, PCBPath adds an internal tracking number on the silkscreen layer to prevent panel mix-ups during multi-process manufacturing and ensure strict batch traceability.
Specify Location for Free No Extra Charge
To place the tracking number in a hidden area (e.g., beneath an IC or connector), add the placeholder text "PCBPATH" (or "PP") on your silkscreen layer. Our CAM engineers will replace it with the internal order number. Ensure font height is ≥ 0.8 mm and line width is ≥ 5 mil (0.127 mm).
Remove Product Number Aesthetics
Select "Yes" if you require an entirely clean board surface with zero factory markings. An extra fee of approximately $1.5 applies for individual manual tracking during fabrication.
No Yes Specify a Location
Confirm Production File:
Confirm Production File CAM & EQ Review
Allows you to manually review working Gerber files and Engineering Queries (EQ) before fabrication begins to prevent layout discrepancies and assembly losses.
How It Works Default: No
• When "Yes" is selected, an EQ review link is sent via email and updated in your order dashboard.
• You can approve directly or add annotations on the file to request revisions until you are fully satisfied.
Confirmation Policy Order Rules
• Orders < $300: Please confirm within 4 days; otherwise, the order automatically proceeds to avoid fabrication delays.
• Orders ≥ $300: Manual confirmation is mandatory before production can start.
No Yes
Paper Between PCBs:
Without Paper (Direct Contact) Direct Board-on-Board Friction During Transit Solder Mask Scuffs & Gold Abrasion Risk Interleaved Paper Strips (Protected) Soft Acid-Free Paper Shielding Every Board PROTECTIVE PAPER 100% Scratch-Free · Flawless Cosmetic Finish
Why Insert Paper Between PCBs? Packaging Protection
Clean, acid-free protective paper strips are interleaved between individual boards inside vacuum-sealed packaging. This cushions boards against vibration during transit, completely preventing surface scuffs, scratches, and friction marks.
Recommended Scenarios Cosmetic Integrity
• Sensitive Solder Masks: Highly recommended for Black or Matte Black finishes, which easily reveal minor cosmetic rubs.
• Gold Finishes: Ideal for ENIG, Hard Gold, or Gold Fingers to avoid pad micro-abrasions and ensure optimal solderability.
No Yes
Humidity Indicator Card:
Packaging Specs: Humidity Indicator Card (HIC) IPC/JEDEC J-STD-033 Standard · Real-Time Enclosed Package Humidity Verification HUMIDITY INDICATOR CARD BLUE = DRY / PINK = HUMID 10% 50% 60% Pink Spot = Moisture Alert Exceeded RH threshold Baking required before SMT Blue Spot = Safe / Dry Package seal intact Ready for direct assembly Moisture Barrier Bag Verification · IPC/JEDEC Compliant
What is a Humidity Indicator Card (HIC)? MSD Quality Control
A Humidity Indicator Card is a moisture-sensitive chemical test card sealed inside vacuum Moisture Barrier Bags (MBB) alongside desiccant packs. It displays real-time relative humidity (RH) levels to ensure components and boards have not absorbed excessive moisture during transit.
Reading Guide & Action Protocol J-STD-033 Guidelines
• Blue Spots (Safe): Indicates dry, controlled atmospheric conditions inside the vacuum seal. Components are ready for immediate SMT assembly.
• Pink Spots (Moisture Alert): Indicates relative humidity has breached safe limits. If the 10% spot turns pink and the 50% or 60% spot fades, baking is recommended prior to reflow to prevent delamination or popcorn defects.
No Yes
PO Number
Other Requests
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