Qualcomm’s AI-native Wi-Fi 8 platforms, R19-ready 5G modems, and custom Oryon CPUs set the company up for the next generation of mobile and networking infrastructure.
Qualcomm Levels Up Mobile Processors, Wi-Fi 8 Portfolio, and RF Hardware
TE Connectivity AMPSEAL Robust Headers | Featured Product Spotlight
TE Connectivity AMPSEAL Robust Headers provide secure, high-reliability PCB connectivity designed for demanding industrial, commercial, and transportation applications. Watch and learn all about their features, specs, applications, and more!
Memory Moves: Upgrades to HBM4, eMMC, LPDDR5X, & MRAM Across Industries
Memory makers big and small are innovating storage solutions to meet the mounting needs of AI, industrial factories, software-defined vehicles, and space exploration.
OKI Reaches New Heights With a 124-Layer PCB
The 124-layer printed circuit board surpasses the longstanding 108-layer industry ceiling without increasing the standard board thickness of 7.6 mm.
Stamp Turns Messy Breadboards Into Swappable PCB Blocks
Kickstarter project Stamp aims to eliminate crowded breadboards using universal modular breakout PCBs.






