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Advanced PCB Capabilities

| PCBPath Editorial Team

At first glance, printed circuit boards (PCBs) may seem similar in appearance, regardless of their inherent quality. However, the true differences lie beneath the surface, where factors critical to durability and functionality come into play.

We specialize in highly precise PCBs and offer large-scale production capabilities, ensuring that no order is too small or too large. By producing PCBs sustainably and at the lowest total cost, we prioritize competence, delivery accuracy, and product quality.

Advanced High-quality PCB Manufacturing Capabilities

Item / Capability Process Capability Parameter
Base Material FR-4|High Tg|Halogen-free
PCB Type Standard PCB | HDI (Any-layer support)
Max Layer Count Up to 24 Layers
Base Copper Thickness Min 1/3 OZ (12μm)
Max Finished Copper Thickness Up to 8 OZ
Min Trace Width / Spacing Inner/Outer Layers 2/2 mil
Hole to Conductor Spacing Min 6 mil (Inner & Outer)
Annular Ring Via: 3 mil
Component Hole: 5 mil
BGA Specification Diameter: 8 mil
Min Pitch: 0.4 mm
Min Hole Size CNC: 0.15 mm
Laser (Blind/Buried): 0.1 mm
Max Aspect Ratio 20:1
Soldermask Bridge Width Min 3 mil
Circuit Processing Method Film | LDI (Laser Direct Imaging)
Surface Finish Type HASL Lead-Free | ENIG | OSP | ENEPIG | Hard Gold | Immersion Silver(Ag) | Immersion Tin
Max PCB Size 609 * 889 mm
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